White and blue horizontal industrial banners set with socket and wires flat isolated vector illustration
But the lightning-fast ramp-up to EVs is about more than a
change in propulsion systems-it’s driving nothing less than a seismic shift in
electronic architectures. Moving to zonal and centralized computing, ADAS, and
high-frequency data links has made EVs increasingly hungry for board-to-board
B2B connectors, which connect printed circuit boards PCBs directly. These
connectors enable compact, modular electronics that are lighter, faster, and
more reliable.
The board-to-board EV connectors market size is projected to reach US$ 351.72 million
in 2024 and is expected to reach US$ 1609.35 million by 2031. The
board-to-board EV connectors market size is estimated to register a CAGR of
24.5% during 2025–2031.
Growth Strategies
Miniaturization and High Density
The electronics in EVs have also started moving towards
being more integrated and compact. Molex provides Slim Stack and Float Stack
board-to-board connectors with very small pitches and floating capabilities to
accommodate automated assembly.
Modular EV Architectures
With the trend in automotive toward zonal electronic
architectures, multiple PCBs are increasingly being utilized within modules for
systems such as battery management, inverters, and controllers. B2B connectors
support both mezzanine (stacked) and floating designs for modularity and to
allow for misalignment.
Reliability under Harsh Conditions
The board-to-board connectors in an EV have to operate under
vibration, thermal stress, and mating tolerances. The line of board-level
interconnects from TE Connectivity is designed for harsh, high-performance
applications.
High-Speed Data and Shielding
B2B signal integrity connectors will be highly important for
ADAS, infotainment, and high-speed computing. Precise alignment, bullet
adaptors, and tolerance compensations have been designed into Rosenberger
connectors to maintain data integrity even in misalignment conditions.
Strategic Partnerships
Companies are collaborating on expanding capabilities. For
example, Molex and Rosenberger have a dual-sourcing agreement for high-speed
vehicle interconnects that enhances reliability and cost efficiency.
Future Trends
Higher Bandwidth & Centralized Compute
As EVs adopt centralized computing, for example, zonal ECUs
and domain controllers, board-to-board connectors will increasingly handle
higher data rates and more signals per module.
Floating / Self-Aligning Connectors
Tolerance compensation-axial, radial, angular-will become
more common in order to improve assembly yields and robustness. Bullet adaptors
from Rosenberger provide for misalignment without degrading electrical
performance.
Co-design of Power and Signal Paths
Hybrid connectors that cater to both power and data are
finding wider acceptance. Molex’s MX-DaSH portfolio, for example, can integrate
power, signal, and high-speed data in one system.
Higher Voltage and Current Support
With the proliferation of 800 V+ architectures, EV modules
are demanding connectors that support higher currents, low resistance, and
robust contact designs. Molex’s Float Stack and Sentrality systems cater to
such high-current board-to-board use cases.
Sustainability and Efficient Manufacturing
Automatic assembly, self-aligning designs, and minimized
material use through compact pitch reduce waste. In addition, high-reliability
connectors reduce failure rates, thereby improving lifecycle performance.
Key Opportunities
Battery Management Systems: B2B connectors enable
compact stacking of BMS PCBs for efficient cell-level management.
Zonal E/E architectures feature fewer but more
capable ECUs, and board-to-board connectors are used to couple PCBs within
their compute modules.
On-Board Chargers/Inverters /DC-DC Converters: These
kinds of power electronics require very robust B2B connectors, with high
current handling and alignment robustness.
ADAS & Infotainment: High-speed, shielded B2B
interfaces support camera, radar, and display modules.
Emerging Markets: Increased EV production in the
Asia-Pacific region, particularly China and India, opens up a huge opportunity
for growth among B2B connector suppliers.
Key Segments
By Type
Sealed Connector
Unsealed Connector
By Application
ADAS and Safety System
Body Controls and Interior
Infotainment System
Engine Management and Powertrain
Battery Management System
Vehicle Lighting and Others
By Propulsion Type
Battery Electric Vehicle
Plug-In Hybrid Vehicle
Fuel Cell Electric Vehicle
Hybrid Electric Vehicle
By Voltage
Low Voltage
Medium Voltage
High Voltage
Key Players & Recent Developments
Molex LLC
Offers a broad portfolio of board-to-board connectors,
including SlimStack (microminiature) and Float Stack (floating,
tolerance-compensating).
Its Float Stack connectors are designed for EV modules
(inverters, DC-DC, BMS) with a ±0.75 mm float in x, y, z for automated assembly
and are compliant with USCAR V2 and LV214.
For EV applications, Molex also provides its Sentrality Pin
& Socket system, supporting high-current board-to-board, busbar-to-board
connections with self-alignment, making them ideal for EV power modules.
TE Connectivity Ltd
TE offers a wide variety of board-to-board connectors,
including fine-pitch, high-speed backplane, mezzanine, and AMPMODU systems.
Their board-to-board connectors are qualified for harsh
environments. They offer flame-retardant housings, polarization, and strong
contact integrity to support high-reliability automotive systems.
The company is said to be working on an “Inside Device
Connectivity” portfolio for vehicle ECUs and power modules that address
B2B, wire-to-board, among other applications, optimized for high current,
vibration, and EMI-a strong push toward EV module connectivity.
Rosenberger Hochfrequenztechnik GmbH & Co KG
Connectors for board-to-board applications by Rosenberger
use adaptors to provide compensation for misalignments and allow axial and
radial tolerance without loss of signal integrity.
The product range includes very high-frequency connectors,
such as SMP and Mini-SMP, and power/RF hybrid connectors that address telecom
and automotive high-speed data requirements.
The board-to-board designs are especially suitable for
applications where vibration or thermal cycling may cause misalignment of
PCBs-a critical feature for EV modules.
Future Outlook & Conclusion
The evolution of EV electronic architectures is expected to
drive strong growth in the board-to-board connectors market of the EV space. As
original equipment manufacturers transition to zonal E/E, centralized
computing, and higher voltage platforms, there will be a greater need for
compact, high-speed, vibration-resistant, high-current B2B connectors.
Growth will be driven by:
Increasing adoption of modular and stacked PCB designs in EV
modules
Increasing data rates and signal integrity requirements
Demand for automated assembly (floating connectors)
Cost optimization by partnerships and standardization
Challenges include the following:
Ensuring reliability under extreme automotive conditions
Achieving very fine pitches without increasing manufacturing
complexity
Scaling production to keep pace with EV adoption
On the opportunity front, connector suppliers offering
innovative alignment solutions-like self-aligning and floating-will be better
positioned to lead, along with those offering high-current capacity and hybrid
power-data systems. In addition, collaboration with OEMs and Tier-1 suppliers
will be crucial for securing design wins.
In summary, board-to-board EV connectors are not just a
supporting component; they are a key enabler in enabling future EV electronics
to reach higher performance, modularity, and manufacturability.
Frequently Asked Questions (FAQ)
What is a board-to-board connector, and why is it
important in EVs?
A board-to-board connector connects two PCBs together,
usually in a stacked or mezzanine fashion. For EVs, compact and modular
electronics-such as battery controllers and inverters-need high-speed data and
power while minimizing wiring complexity.
How is the board-to-board connector market in EVs
growing?
With increasing EV adoption and a shift toward centralized
and zonal architectures, the requirement for high-density, field-reliable B2B
connectors is increasing. The EV connector market is expected to grow to $8.8
billion by 2032.
What are the key technical trends in B2B EV connectors?
Key trends include floating connectors, for tolerance
compensation; higher data-rate connectors; hybrid power‐and-signal designs; and
connectors for very high current & voltage.
Which companies are leading in board-to-board EV
connectors?
Major players include Molex LLC, TE Connectivity Ltd, and
Rosenberger Hochfrequenztechnik GmbH & Co KG, all of whom are innovating
aggressively in this space.
What are some challenges faced by manufacturers when it
comes to the design of B2B connectors in EVs?
The challenges concern mechanical tolerances (misalignment),
robustness under vibration/temperature cycling, high current capacity, and
signal integrity at high data rates.
Related Reports:
Helicopter Tourism Adventures: See the World from Above
Top Nutraceutical Products for Health and Wellness
Probiotic Supplements Market Size, Share & Industry Analysis
Comprehensive Report on RTD Iced Tea Market Dynamics
Future Outlook of the Board-to-Board EV Connectors Industry
About the Author
